AEHR NASDAQ
Credit Risk of going bust: lower than 59% of companies Debt: 0.5% of company value Bonds: none of note held by US funds details ▾
If the stock fell to about $0.01 (down more than 99.9%), Aehr Test Systems would be worth roughly what it owes.
Total debt $9.9M against a stock market value of $1.85B.
Distance to default 6.04 (Merton model): prices to 2026-10-26, balance sheet 2026-05-29, debt counted $626K (short-term plus half of long-term), stock volatility 120.9%; Altman Z 41.49. A ranking and a back-test, not a forecast.
US fund filings (SEC N-PORT) show under $25M of this company's bonds, so there is no bond page. Its debt may be bank loans or privately placed. How these are computed.
Fremont, CA 94539
US
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.
Recent Insider Trades
| Name | Type | Shares | Price | Date |
|---|---|---|---|---|
| ENGINEER ADIL | F-InKind | 547 | $84.64 | 2026-10-12 |
| Erickson Gayn | F-InKind | 2,675 | $84.64 | 2026-10-12 |
| ROGERS VERNON | F-InKind | 426 | $84.64 | 2026-10-12 |
| RICHMOND DONALD P. I | F-InKind | 388 | $84.64 | 2026-10-12 |
| SPORCK ALISTAIR N | F-InKind | 295 | $84.64 | 2026-10-12 |