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AMKR NASDAQ

Amkor Technology, Inc.
1W: +10.2% 1M: -6.9% 3M: -32.1% YTD: +20.5% 1Y: +109.1% 3Y: +98.0% 5Y: +95.6%
$51.73
+2.20 (+4.44%)
 
Weekly Expected Move ±10.4%
$41 $46 $52 $57 $62
NASDAQ · Technology · Semiconductors · Tech Score Sell · Power 42 · $12.9B mcap · 109M float · 4.94% daily turnover · Short 54% of daily vol
Smart Money Score
Watch 25
Insider
Congress
ETF Holdings
Key Statistics
Market Cap$12.9B
52W Range24.97-96.68
Volume3,059,552
Avg Volume5,373,534
Beta2.23
Dividend$0.33
Analyst Ratings
7 Buy 6 Hold 1 Sell
Consensus Buy
Company Info
CEOKevin K. Engel
Employees30,800
SectorTechnology
IndustrySemiconductors
IPO Date1998-05-01
Websiteamkor.com
2045 East Innovation Circle
Tempe, AZ 85284
US
480 821 5000
About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Recent Insider Trades

NameTypeSharesPriceDate
Faust Megan S-Sale 1,000 $49.05 2026-09-08
ROGERS MARK N S-Sale 5,000 $59.78 2026-08-17
Faust Megan S-Sale 1,000 $54.45 2026-08-11
ALEXANDER DOUGLAS A S-Sale 5,000 $55.81 2026-08-07
Rutten Guillaume Mar S-Sale 25,000 $54.50 2026-08-06

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For informational purposes only. Not investment advice. Data sourced from SEC filings. Privacy Terms