AMKR NASDAQ
Credit Risk of going bust: higher than 80% of companies Debt: 21.8% of company value Bonds: $122.9M held by 187 funds, 175 bp over Treasuries → details ▾
If the stock fell to about $1.54 (down 96%), Amkor Technology, Inc. would be worth roughly what it owes.
Total debt $2.55B against a stock market value of $9.15B.
Distance to default 2.64 (Merton model): prices to 2026-10-26, balance sheet 2026-06-30, debt counted $1.32B (short-term plus half of long-term), stock volatility 80.2%; Altman Z 2.82. A ranking and a back-test, not a forecast.
Bond figures are fund-reported marks (SEC N-PORT) as of Jul 2026. How these are computed.
Tempe, AZ 85284
US
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Recent Insider Trades
| Name | Type | Shares | Price | Date |
|---|---|---|---|---|
| Faust Megan | S-Sale | 1,000 | $46.92 | 2026-10-13 |
| ALEXANDER DOUGLAS A | S-Sale | 5,000 | $55.00 | 2026-10-02 |
| KIM SUSAN Y | A-Award | 4 | — | 2026-09-22 |
| WATSON DAVID N | A-Award | 4 | — | 2026-09-22 |
| Tily Gil C. | A-Award | 4 | — | 2026-09-22 |