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Also trades as: 3711.TW (TAI) · $vol 359M

ASX NYSE

ASE Technology Holding Co., Ltd.
1W: -15.1% 1M: -14.9% 3M: +10.1% YTD: +101.5% 1Y: +223.5% 3Y: +360.3% 5Y: +371.8%
$33.93
-2.62 (-7.17%)
 
Weekly Expected Move ±10.9%
$29 $33 $37 $41 $45
NYSE · Technology · Semiconductors · Alpha Radar Sell · Power 37 · $74.4B mcap · 1.63B float · 0.653% daily turnover · Short 48% of daily vol
Smart Money Score
Watch 25
Insider
Congress
ETF Holdings
Key Statistics
Market Cap$74.4B
52W Range9.3-45.52
Volume8,857,326
Avg Volume10,632,735
Beta1.46
Dividend$0.42
Analyst Ratings
4 Buy 0 Hold 1 Sell
Consensus Buy
Company Info
CEOJason Chang
Employees96,436
SectorTechnology
IndustrySemiconductors
IPO Date2000-10-02
26, Chin 3rd Road
Kaohsiung, KH 811
TW
886 7 361 7131
About ASE Technology Holding Co., Ltd.

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

Recent Insider Trades

NameTypeSharesPriceDate
Chang Hung Pen M-Exempt 3,000,000 $41.10 2026-07-13
Chang Hung Pen M-Exempt 1,500,000 $98.60 2026-07-13
Chang Hung Pen M-Exempt 3,000,000 $41.10 2026-07-13
Chang Hung Pen M-Exempt 1,500,000 $98.60 2026-07-13
Chen Jeffrey S-Sale 9,000 $506.00 2026-05-18

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