ASX NYSE
Credit Risk of going bust: higher than 51% of companies Debt: 9.0% of company value Bonds: none of note held by US funds details ▾
Total debt $9.14B against a stock market value of $92.48B.
Distance to default 5.01 (Merton model): prices to 2026-10-27, balance sheet 2026-06-30, debt counted $5.68B (short-term plus half of long-term), stock volatility 57.9%; Altman Z'' 1.29. A ranking and a back-test, not a forecast.
US fund filings (SEC N-PORT) show under $25M of this company's bonds, so there is no bond page. Its debt may be bank loans or privately placed. How these are computed.
Kaohsiung, KH 811
TW
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
Recent Insider Trades
| Name | Type | Shares | Price | Date |
|---|---|---|---|---|
| Uang Du-Tsuen | S-Sale | 3,000 | $752.00 | 2026-10-12 |
| Chang Hung Pen | M-Exempt | 300,000 | $98.60 | 2026-09-22 |
| Chang Hung Pen | M-Exempt | 300,000 | $98.60 | 2026-09-22 |
| Tsai Chi-Wen | A-Award | 334,000 | — | 2026-09-07 |
| Chung Chih-Hsiao | A-Award | 30,000 | — | 2026-09-07 |