ASMVF OTC

ASMPT Limited, an investment holding entity, specializes in the global development, production, and distribution of machinery, instruments, and consumables utilized within the semiconductor and electronics assembly sectors. Its operations are divided into two primary segments: Semiconductor Solutions and Surface Mount Technology Solutions. The company's diverse product portfolio encompasses equipment for deposition processes, wafer separation, AOI/FOL, die attachment, wire bonding, dispensing, encapsulation, and CIS. It also provides systems for singulation, trimming, forming, LED testing, sorting, taping, sintering, and final testing and handling. Furthermore, ASMPT delivers a range of surface mount and advanced packaging technologies, alongside solutions for encapsulation, MEMs, power management, LED/optoelectronics, photonics, COB, stacked die configurations, and intelligent SMT factory automation, including applications for image sensors. Ancillary services include agency and logistics. Established in 1975 and headquartered in Tsing Yi, Hong Kong, the company was previously known as ASM Pacific Technology Limited until its renaming in June 2022.